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ELECTRONIC AND ELECTROMECHANICAL COMPONENTS

YOUR LEADING ELECTRONICS MANUFACTURERS REPRESENTATIVE
Electronics manufacturers representative for Ohio, PA, IN, MI, WV and KY

Serving OH, MI, IN, W. PA, WV and KY

Low Profile Board-to-Board and Flex Cable-to-Board SMT Connectors

Robust, Low Profile SMT Connectors: Mezza-pede® 1.0mm pitch SMT Connectors from Advanced Interconnections

Mezza-pede® 1.0mm pitch SMT Connectors from Advanced are designed for low profile board-to-board or flex cable-to-board applications where long-term reliability and a compact size are required.

Ask about their NEW lower profile designs with a mated height of only 2.92mm!

With Advanced’s enclosed screw-machined socket, 6-finger contact and heavy gold plating, Mezza-pede® Connectors pass the 20-day mixed flowing gas (MFG) test required in many telecom and other severe environment and long-life applications.

Their over-molded lead frame seals the surface mount leads to prevent solder wicking, ensuring a secure solder joint. The low stack height makes it ideal for tight mezzanine packaging applications.

Typical Applications

  • Tunable Laser power connector (flex cable to board)
  • Tunable Laser connector (board to board)
  • Signal connector (flex cable to board)
  • Low profile board to board connector

Features

  • Low profile – board to board stack height (z-axis) options ranging from 2.9mm to 4.0mm (nom.).
  • Robust design features screw-machined terminals and multi-finger contacts with a per contact current rating of greater than 1 Amp at 80°C ambient.
  • Dual row configurations include 8, 14, 20, 30, or 36 total positions with other pin counts available on a customized basis.
  • Fits within existing board layouts.
  • Unique SMT lead frame and pin design prevents solder wicking, providing the highest quality solder joint at the PCB level.
  • SMT and thru-hole designs available.
  • Passed 20-Day MFG test with heavy gold terminal plating (GH).
  • Qualified for use in telecommunications applications.
  • RoHS Compliant

How it Works

 

Thru-hole Flex Cable Applications

Thru hole Flex Cable Application
  • The male terminals are supplied in a polyimide film carrier to facilitate handling (model DHA).
  • A stiffener with a recommended thickness of .020 inches (0.51mm) should be used between the terminal pins and the flex circuit. (Stiffener not supplied)
  • The recommended maximum hole in the stiffener is .018″ diameter.
  • The flex circuit should have a minimum diameter plated through hole of .016″. Standard practices for flex circuit thru-hole and annular rings should apply.
  • An FR-4 cover can be used to protect the top solder joints if required. (not supplied)

SMT Board to Board Applications

SMT Board to Board Application
  • In an SMT application, the SMT socket (DHS or DHSL) and header (DHA, DHAM, or DHAL) can be used on PC boards, rigid flex or flex circuits.
  • SMT pad size should meet IPC standards for surface mount components.
  • See lead dimension and foot size on applicable CAD drawing for reference.
  • Tape and reel packaging is provided for SMT assembly.

More Info

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Salesmasters is honored to serve as a manufacturer’s rep for Advanced Interconnections, a leading designer and manufacturer of innovative, technologically advanced interconnect solutions.