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ELECTRONIC AND ELECTROMECHANICAL COMPONENTS

YOUR LEADING ELECTRONICS MANUFACTURERS REPRESENTATIVE
Electronics manufacturers representative for Ohio, PA, IN, MI, WV and KY

Serving OH, MI, IN, W. PA, WV and KY

Make device testing quick and easy with Flip-Top™ Ball Grid Array test sockets

BGA and LGA device testing is tremendously important, but it can be time consuming to solder or apply external hold-downs on the PC board.

Luckily, Advanced Interconnections has removed a lot of testing stress with their flip-top ball grid array socketing systems. See them in action in the following YouTube video:

Test socket models are available in 1.27mm, 1.00mm, and .5mm pitches. Find out more about model specifications on Advanced’s site:
Advanced Interconnections offers a wealth of options in image sensor sockets to consider.

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Salesmasters is honored to serve as a manufacturer’s rep for Advanced Interconnections.